New CPUs announced by AMD and Intel during CES 2023

Last updated on January 19, 2023

The latest edition of the Consumer Electronics Show (CES) took place in Las Vegas on Jan. 5-8, 2023 and it was the opportunity for many manufacturers to present their new products. This was the case for AMD and Intel who both announced new processors.

AMD

AMD announced additional Raphael desktop processors that use the Zen 4 microarchitecture and the AM5 socket. The new AMD Ryzen 5 7600, AMD Ryzen 7 7700 and AMD Ryzen 9 7900 have a slightly lower frequencies than their 7000X counterparts but have a lower TDP (65 W) and are likely to be found in new systems from popular vendors such as Acer, Dell, HP and Lenovo for instance. AMD has also announced new desktop gaming processors with 3D-stacked L3 cache: the AMD Ryzen 7 7800X3D, AMD Ryzen 9 7900X3D and AMD Ryzen 9 7950X3D that should become available in February 2023 and are expected to be excellent gaming CPUs.

The CES was also the opportunity for AMD to announce many new mobile CPUs that are part of the 7000 series. The naming convention is a bit confusing (some would say misleading) because these mobile CPUs use different microarchitectures and lithography processes:

• The 7030U CPUs (Ryzen 3 7330U, Ryzen 5 7530U, Ryzen 7 7730U,…) are part of the Barcelo Refresh family. They use the Zen 3 microarchitecture and they have a slightly higher boost frequency than their Barcelo counterparts. They are manufactured using the TSMC 7nm FinFET lithography process.
• The 7035U (Ryzen 3 7335U, Ryzen 5 7535U, Ryzen 7 7735U, Ryzen 7 7736U) and 7035HS CPUs (Ryzen 5 7535HS, Ryzen 7 7735HS) are part of the Rembrandt Refresh family. They use the Zen 3+ microarchitecture and, once again, they have a slightly higher boost frequency than their Rembrandt counterparts. They are manufactured using the TSMC 6nm FinFET lithography process.
• The 7040HS (Ryzen 5 7640HS, Ryzen 7 7840HS, Ryzen 9 7940HS) CPUs are part of the Phoenix family. They use the new Zen 4 microarchitecture and are manufactured using the new TSMC 4nm FinFET lithography process.
• Finally, the 7045HX CPUs (Ryzen 5 7645HX, Ryzen 7 7745HX, Ryzen 9 7845HX, Ryzen 9 7945HX) are part of the Dragon Range family. They have up to 16 Cores which makes them the most powerful mobile CPUs announced by AMD. They use the Zen 4 microarchitecture and are manufactured using the TSMC 5nm FinFET lithography process.

Intel

Intel had announced their first 13th Generation Raptor Lake CPUs last September 2022. The CES 2023 was therefore the opportunity to unveil additional desktop and mobile CPUs that will become available during Q1 2023. On the desktop side, the new entry leve 13th Generation Intel Core i3 Processors have no E-cores and have slightly higher frequencies than their Alder Lake counterparts. Intel has also unveiled new 13th Generation Intel Core i5 Processors during the CES. They have less L2 Cache (2 MB of shared L2 per E-core module instead of 4 MB) than the existing Intel Core i5-13600K and Intel Core i5-13600KF. But they have nevertheless better performance than their Alder Lake counterparts and they will soon appear in many new models of computers. Intel also announced new 13th Generation Intel Core i7 Processors and 13th Generation Intel Core i9 Processors with better performance than their Alder Lake counterparts. Finally and shortly after the CES, Intel has unveiled the first processor with a turbo boost frequency of 6 GHz out of the box: the Intel Core i9-13900KS. This CPU is certainly one of the most powerful processors to date.

The Las Vegas CES 2023 was also the opportunity for Intel to announce the Raptor Lake mobile CPUs:

• The low power Raptor Lake-U series of processors (Intel Processor U300, i3-1305U, i3-1315U, i5-1334U, i5-1335U, i5-1345U, i7-1355U, i7-1365U) have a base TDP of only 15 W but may consume up to 55 W for short periods of time.
• The Raptor Lake-P series of processors (i5-1340P, i5-1350P, i7-1360P, i7-1370P) have a base TDP of 28 W (they may consume briefly up to 64 W) and will soon appear in new models of laptops from vendors such as Acer, Dell, HP and Lenovo.
• The Raptor Lake-H and Raptor Lake-HK series of CPUs (i5-13420H, i5-13500H, i5-13505H, i5-13600H, i7-13620H, i7-13700H, i7-13705H, i7-13800H, i9-13900H, i9-13900HK, i9-13905H) are more powerful, they have a base TDP of 45 W (they may consume up to 95 W or 114 W during a short period of time).
• Finally the Raptor Lake-HX series (i5-13450HX, i5-13500HX, i5-13600HX, i7-13650HX, i7-13700HX, i7-13850HX, i9-13900HX, i9-13950HX, i9-13980HX) are the most powerful mobile processors announced by Intel to date with up to 24 Cores. They have a base TDP of 55 W and may consume up to 157 W during brief periods of time. These CPUs will soon appear in the latest generation of gaming laptops.

The following lists provide access to the details of these new CPUs:

New Desktop processors:

New Laptop processors:

These data were obtained from the manufacturers and have been completed manually where necessary. Please contact us at the following email address if you detect an error: